| Number | Project | Processing capacity |
| 1 | Layers | 2-20 |
| 2 | Plate type | FR-4，High-frequency, Cu-base,AI-base |
| 3 | Biggest size | 500mm*800mm |
| 4 | Dimensional Accuracy | ±0.1mm |
| 5 | Plate thickness range | 0.20mm--5.00mm |
| 6 | Plate Thickness Tolerance （t≥0.8mm） | ±8% |
| 7 | Plate Thickness Tolerance （t＜0.8 mm） | ±10% |
| 8 | Media thickness | 0.075mm--5.00mm |
| 9 | Minimum line width | 0.075mm- |
| 10 | Minimum spacing | 0.075mm- |
| 11 | Outer copper thickness | 35μm--280μm |
| 12 | Inner layer copper thickness | 17-μm-280μm |
| 13 | Drilling hole diameter (mechanical drill) | 0.15mm--6.35mm |
| 14 | Finished Aperture (Mechanical Drill) | 0.10mm--6.30mm |
| 15 | Bore Tolerance (Mechanical Drill) | ±0.05mm |
| 16 | Hole tolerance (mechanical drill) | ±0.75mm |
| 17 | Plate thickness aperture ratio | 13:1 |
| 18 | Solder mask type | Lp1 |
| 19 | Minimum Solder Mask Bridge Width | 0.08mm |
| 20 | Minimum Solder Mask Isolation Ring | 0.05mm |
| 21 | Plug hole diameter | 0.25mm--0.60mm |
| 22 | Impedance tolerance | ±10% |
| 23 | L Surface treatment type | HASL,ENIG,Immersion Tin,Immersion Ag,OSP,Flash Gold finger |
